MIJING
Mijing A14 3D BGA Stencil IC Solder Reball Tin Plant Net for iPhone 12 Series
Mijing A14 3D BGA Stencil IC Solder Reball Tin Plant Net for iPhone 12 Series
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2. High success rate of planting tin,the solder balls can be formed once after you are proficient.
3. This 3D planting stencil is thicker than ordinary stencils in the market .Less tendency of deformation makes its using life be longer.
4. The square holes design makes it easier to take out the formed solder balls.
5. Professional and practical, compact and portable.
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